Subtron Technology Co., Ltd.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 41321
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 41115
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM6151
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 390
 
  
 
F28F DETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION 250
 
  
 
H01K ELECTRIC INCANDESCENT LAMPS 220
 
  
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 1124
 
  
 
B44C PRODUCING DECORATIVE EFFECTS 133
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 1100
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 150

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0325,330 MANUFACTURING METHOD OF CIRCUIT SUBSTRATEJun 07, 16Nov 09, 17[H05K]
2017/0079,128 PACKAGE CARRIER AND MANUFACTURING METHOD THEREOFJan 19, 16Mar 16, 17[H01L, H05K]
2015/0144,315 HEAT DISSIPATION SUBSTRATEJan 13, 14May 28, 15[F28F]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9883594 Substrate structure for packaging chipJul 13, 17Jan 30, 18[H05K]
9883599 Manufacturing method for multi-layer circuit board having cavityJan 23, 15Jan 30, 18[H05K]
9870931 Package carrier and manufacturing method thereofJan 19, 16Jan 16, 18[H01L, H05K]
9761515 Substrate structureMar 31, 17Sep 12, 17[H01L]
9693468 Package substrate and manufacturing method thereofSep 07, 15Jun 27, 17[H01L, H01K, H05K]
9668351 Package carrier and manufacturing method thereofApr 15, 15May 30, 17[H01L, H05K]
9655254 Manufacturing method of circuit substrateJul 17, 12May 16, 17[B23K, H05K, B32B]
9648760 Substrate structure and manufacturing method thereofFeb 25, 16May 09, 17[H05K]
9603263 Manufacturing method of circuit substrateJul 19, 12Mar 21, 17[H05K]
9589942 Package structure and manufacturing method thereofMar 31, 15Mar 07, 17[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2017/0086,293 PACKAGE CARRIER AND MANUFACTURING METHOD THEREOFAbandonedNov 05, 15Mar 23, 17[H05K]
2016/0095,256 HEAT DISSIPATION MODULEAbandonedMar 27, 15Mar 31, 16[F28D, H05K]
2016/0050,761 SUBSTRATE STRUCTURE AND METHOD OF MANUIFACTURING THE SAMEAbandonedNov 06, 14Feb 18, 16[H05K]
2015/0296,618 SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOFAbandonedMay 26, 14Oct 15, 15[H05K, B32B]
2015/0136,364 HEAT DISSIPATION DEVICEAbandonedJan 13, 14May 21, 15[H01L]
2015/0114,698 SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOFAbandonedDec 13, 13Apr 30, 15[H05K]
2014/0345,841 HEAT DISSIPATION PLATEAbandonedJul 05, 13Nov 27, 14[F28F]
2014/0209,665 METHOD FOR BONDING HEAT-CONDUCTING SUBSTRATE AND METAL LAYERAbandonedApr 02, 14Jul 31, 14[B23K]
2014/0168,163 OPTICAL TOUCH SENSING STRUCTUREAbandonedMar 31, 13Jun 19, 14[G06F]
2014/0113,788 PACKAGING PROCESSAbandonedDec 07, 12Apr 24, 14[B31B]
2014/0041,922 PACKAGE CARRIER AND MANUFACTURING METHOD THEREOFAbandonedSep 14, 12Feb 13, 14[H05K]
2013/0329,386 PACKAGE CARRIER AND MANUFACTURING METHOD THEREOFAbandonedAug 27, 12Dec 12, 13[C25D, H05K]
2013/0319,620 BOARD SEPARATION APPARATUS AND OPERATING METHOD THEREOFAbandonedAug 23, 12Dec 05, 13[B32B]
2013/0107,246 OPTICAL TOUCH SENSING STRUCTURE AND MANUFACTURING METHOD THEREOFAbandonedFeb 24, 12May 02, 13[G01J, B05D, G03F, B32B]
2013/0043,016 STRUCTURE AND PROCESS OF HEAT DISSIPATION SUBSTRATEAbandonedNov 10, 11Feb 21, 13[F28F, B21D]
2012/0314,369 PACKAGE CARRIER AND PACKAGE STRUCTUREAbandonedOct 27, 11Dec 13, 12[H05K]
2012/0293,977 PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOFAbandonedNov 04, 11Nov 22, 12[H05K]
2012/0181,066 PACKAGE CARRIERAbandonedMar 01, 11Jul 19, 12[H05K]
2012/0175,044 MANUFACTURING METHOD OF THERMAL CONDUCTIVITY SUBSTRATEAbandonedMar 22, 12Jul 12, 12[B32B]
2012/0088,117 SUBSTRATE STRUCTUREAbandonedNov 29, 10Apr 12, 12[B32B]

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